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COPPER PLATING CHEMICALS

 

CHEMICALS FOR COPPER PLATING

 

Copper coatings are used as the underlayer when applying multiple protective, decorative and multifunctional coatings on steel products; used to improve soldering; to create conductive layers; for the local protection of steel parts when carburizing, nitriding, boriding and other diffusion processes; in electroplating to build up metal thick layers when exemplifying art products. For copper plating both acidic and alkaline electrolytes are applied.

Простые сернокислые электролиты для меднения

Simple sulfuric acid electrolytes for copper plating

ДFor electrochemical deposition of copper large number of electrolytes were developed, which can be divided into two main groups: simple (acid) electrolytes and complex (mostly alkaline). From simple acidic electrolytes sulfurous and hydrofluoboric ones found the greatest application. Acidic electrolytes are simple in structure, stable in operation, allow to perform the deposition at relatively high current densities, especially at elevated temperatures and under stirring, have current efficiency of about 100%. Copper is evolved with positive potential andcathodic polarization not exceeding 50 - 60 mV, so the copper sediments are coarse-grained, but rather dense. The main components of sulfuric acid electrolytes are copper sulphate and sulfuric acid.

Copper sulphate is the source of the metal ion coating, and sulfuric acid is needed to prevent hydrolysis of copper sulfate for increasing the conductivity of the solution. Sometimes organic additives are used to smooth the surface and make it shine.


Brightening agent for copper plating Master series

 

Chemical composition:

Copper sulphate (Copper sulfate CuS04'5H20): 160-230 g/l
Sulfuric acid (H2S04): 50-70 g / l
Chloride Cl-: 60-120 ml / lConductors coppering

Additives:

Master Mu: 6 ml / l
Master A: 0.6 ml / l
Master B: 0.4 ml / l
Temperature range: 18-40S
Current density: 1-10 A /dm2, compressed air mixing.
Anode type: phosphorus-containing copper anodes in the form of plates.

Specification: A wide range of operating current densities, smooth, brightening, durable coatings. The stability of the electrolyte, the possibility of long-term use, no hazardous decomposition products. Widely used for copper plating of lighting elements, hardware elements etc.

Solutions adjustment:

Master Mu: 30-40 ml / KAH
Master A: 50-80 ml / KAH
Master B: 50-80 ml / KAH

 

Chemical agent for copper plating 550 Series

 

Chemical composition:

Copper sulfate: 160-230 g / l Parts coppering
Sulphuric acid: 30-40 g / l
Chlorides: (d = 1.84) 50-100 ml / l

Additives:

Mu 550: 6 ml / l
550 A: 0.6 ml / l
550 B: 0.4 ml / l
Temperature range: 18-40S
Current density: 1-10 A / dm2

Specification: A wide range of operating current densities, smooth, brightening, durable coatings of metal and non-metal products and thermoplastic items.

Solutions adjustment:

550 Mu: 30-40 ml / KAH
550 A: 50-80 ml / KAH
550 B: 50-80 ml / KAH

 

Chemical agent for copper plating 210 Series

 

Chemical composition:Parts coppering

Copper sulfate: 160-230 g / l
Sulphuric acid: 30-40 g / l
Chlorides: (d = 1.84) 50-100 ml / l

Additives:

Mu 210: 6 ml / l
210 A: 0.6 ml / l
210 B: 0.4 ml / l
Temperature range: 18-40S
Current density: 1-10 A / dm2

Specification: A wide range of operating current densities, smooth, brightening, durable coatings, economical consumption of electrolyte.

Solutions adjustment:

210 Mu: 40-50 ml / KAH
210 A: 50-80 ml / KAH
210 B: 50-80 ml / KAH

 

Chemical agent for copper plating 910 Series

 

Chemical composition:

Copper sulfate: 160-230 g / l Conductors coppering
Sulphuric acid: 30-40 g / l
Chlorides: (d = 1.84) 50-100 mL / L<

Additives:

Mu 910: 6 ml / l
910 A: 0.6 ml / l
910 B: 0.4 ml / l
Temperature range: 20-40S
Current density: 1-10 A / dm2

Specification: A wide range of operating current densities, smooth, brightening, durable coatings, economical consumption of electrolyte.

Solutions adjustment:

910 Mu: 30-40 ml / KAH
910 A: 50-80 ml / KAH
910 B: 50-80 ml / KAH

 

Brightening agent for copper plating MB 260 series
(electrodeposition in galvanic drums)

 

Chemical composition:

Copper sulfate: 100-150 g / l Coppering of machine parts
Sulphuric acid: 40-65 g / l
Chlorides: (d = 1.84) 40-60 ml / l

Additives:
260 MB A: 0.4-0.6 ml / l
MB 260 B: 0.8-0.12 ml / l
260 MB Mu: 3-5 ml / l
Temperature range: 22-30S

Specification: A wide range of smooth, brightening surface, easy adjustment, maintenance and operation of the electrolyte. Electrolyte is ideal for electrodeposition in galvanic drums.

Extra options:

Anodic current density: 1-2 A / dm2
Anodic current density 0.6-1.2 A / dm2
Anode type: phosphorus-containing copper anodes
Filter: continuous filtration of the electrolyte

 

Complex electrolytes for copper plating

 

An advantage of complex electrolytes (e.g., pyrophosphate) for copper plating is the ability for depositing copper directly on steel, aluminum, molybdenum, and other metals, but can get good adhesion only with appropriate pretreatment. In complex alkaline electrolytes copper is composed of complex ions, a degree of dissociation is small, therefore requiring higher cathodic polarization. In this regard, copper sediments from complex electrolytes have fine-grained structure. A large number of complex alkaline electrolytes was developed: cyanide, pyrophosphate, ethylene diamine, ammonium and other electrolytes.

Cyanide electrolytes have best specifications: high diffusing power, fine-grained sediment, copper is directly deposited on steel has good adhesion to the substrate. However, cyanide electrolytes includes toxic substances that severely restrict their use. Worthy replacement for cyanide electrolytes are pyrophosphate electrolytes, which are simple in structure, stable and harmless. Copper is deposited at high cathodic polarization, copper sediments are dense and fine-grained. The diffusing power of the electrolyte similar to cyanide. Ammonia electrolytes and ethylenediamine electrolytes have good plastic sediments, but the first don’t enough stable due to the volatility of ammonia, and ethylenediamine electrolytes environmentally dangerous and relatively expensive, that’s why pyrophosphate copper plating electrolyte is the most appropriate.

 

Complex chemical agent for copper plating MC 622

 

Chemical composition:

Copper plating on suspensions

Copper plating drums

Pawls copperingSpecification: active chemical agent not containing cyanide, safe for the environment suitable for aluminum alloys, copper, steel, iron, cast iron coatings, provides hard even adhesion to the basic metal surface, high resistance to impurities, simple solution adjustment.

Potassium hydroxide 60-100 g / l 60-100 g / l
Bluestone 25-30 g / l 25-30 g / l
Additives:
MS 622 A
MS 622 B

20-35 ml / l
110-130 мл/литр

20-35 ml / l
120-140 мл/литр

PH level 9.0-10.5 9.5-11.0
Current density 0.5-4 А/dm2 0.2-2 А/dm2
Temperature range: 40-60S
The ratio of the anodes and cathodes 1: 2-3
Compressed air stirring, continuous filtration.

 

Pyrophosphate chemical agent for copper plating PCU-1

 

Chemical composition:

Copper pyrophosphate: 75-95 g / l
Potassium pyrophosphate: 280-350 g / l
Ammonia: 1-3 ml / l
Brightening additive PCU -1: 2-0,4 0 ml / l
The ratio of P: (P2O74- / Cu2 +) 6.6-7.3
Level: PH 8.6-9.0
Temperature range: 50-60 ℃
Current density: 1-6 A / dm2
Anode type: copper
Compressed air stirring.
Filter Type: continuous filtration

Solutions adjustment:
Brightening agent PCU -1: 100-150 ml / KAH
Ammonia: 200-300 ml / KAH

Specification: easy to use, economical to use in conjunction with brightening additives, provides solution stability, surface smoothness and a uniform coating of ideal thickness.Plumbing fixtures coppering

 

Cyanide chemical agent for copper plating LM3

 

Chemical composition:

Copper cyanide: 50-60 g / l
Sodium cyanide: 70-85 g / l
Sodium hydroxide 1-3 g / l Fasteners coppering
Additive: 25-30 ml / l
LM3 brightening additive of strong effect: 3-6 ml / l
LM4 brightening additive for special purpose: 3-6 ml / l
Temperature range: 35-50 ℃
Current density: 0.5-3A / dm2

Solutions adjustment:
LM3 brightening additive of strong effect: 50-100 ml / KAH
LM4 brightening additive of weak effect: 250-300 ml / KAH

Specification: The coating is smooth, dense and high quality. A wide range of current density. Easy to operate, adjust electrolyte solutions. The possibility of plating in galvanic drums and suspensions.

 

Copper powder CU-200

 

Chemical composition:Collars coppering

Sulphuric acid: 50-60 ml / l
Copper powder: 30-50 g / l
Temperature range: 40-50 ℃
Time: 0.5-2 minutes

Solutions adjustment:
Sulfuric acid reacts with copper powder and copper sulfate is formed. It is necessary to add 400 g of copper sulftate to 1 kg of sulfuric acid.

Specification: widely used for surface protection against corrosion, easy to operate, easy to maintain.